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CVD Products - Systems
APPLICATIONS MATERIALS SYSTEMS
Genus' thin film products are delivered via our LYNX series of processing equipment. We offer the LYNX2® for
200mm wafer processing and the new LYNX3™ for 300mm
processing. These workhorses for thin film deposition are equipped
with a full range of desired features and performance capabilities
including:
- Reliable wafer transport
- High availability and
yield
- Multi-purpose single-wafer
processing chambers
- Full integration capabilities
for factory automation
- Small footprint (consuming
less floor space in the fab facility)
- Powerful software interface,
fully featured for volume production and ease of use
At the time of its introduction in 1994, and still today, the LYNX series is state-of-the-art in both design and performance for semiconductor processing production equipment. The LYNX series was designed to address several important industry requirements:
- the need to implement single-wafer processing for improved film performance and contamination control;
- the need for compatibility of system software and mechanics with automated fabrication lines;
- the ability to handle and to process larger silicon wafers; and
- providing an open architecture that can accommodate the integration of other process modules and/or processes -- even those from other manufacturers.
Genus customers receive LYNX systems that are customized for their particular needs. We also offer dedicated, field support technicians on a contractual basis. Regularly scheduled classes for administering and servicing the LYNX series equipment are available to customers and employees alike at the Customer Training and Support Center located in our Sunnyvale headquarters.
The LYNX2
This production-proven platform has been the backbone of Genus'
thin film success in recent years. The LYNX2
has a history of high performance in the world-leading, high-volume
DRAM fabs.
See LYNX2
for more details.
The LYNX3
The LYNX3 is an evolution of the LYNX2,
accommodating the handling and processing of 300mm wafers and featuring
newly engineered capabilities for enhanced processing and productivity.
The LYNX3 system is designed for 0.13
micron (and below) manufacturing applications.
See LYNX3
for more details.
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