Genus Ships First ALD Bridge Tool to Korea

System Designed with Added Flexibility for Advanced R&D Applications

SUNNYVALE, Calif.-March 18, 2003- Genus, Inc. (NASDAQ : GGNS) today announced shipment of its first 200/300 mm atomic layer deposition (ALD) bridge tool to a Korean IC manufacturer for advanced R&D applications. This advanced-capabilities system, built on Genus' production-proven StrataGem300 platform, is designed to provide previously unavailable wafer size and ALD film deposition flexibility. Capabilities include 200 mm or 300 mm wafer processing as a standard feature, production-worthy deposition of process-of-record ALD films and a proprietary precursor delivery design for deposition of advanced ALD films and nanolaminates.

"This unique tool, built on the backbone of our production-worthy StrataGem300, was designed specifically for the research and development flexibility that our customer requires," said Bill Elder, CEO of Genus, Inc. "The advanced capabilities of this system provide the competitive edge our customers demand to develop and bring new technology and processes to the IC device manufacturing floor. We expect there will be great interest in this kind of tool from other advanced thin film research and development facilities throughout the world."

"This tool truly bridges the research and development gap, from established processes-of-record to cutting-edge advanced films and nanolaminate films," said Tom Seidel, CTO of Genus, Inc. "Genus provides this capability on a field-proven platform designed to accommodate either 200 mm or 300mm wafers. Customers can process wafers of either size completely at their discretion, and according to their technology roadmap timeline. Genus has also provided an advanced chemical precursor delivery system that provides unmatched process flexibility to the customer." "The bottom line is," continued Dr. Seidel, "as IC device geometries shrink, Genus will continue to meet our customers' needs with our advanced ALD technology."

Werner Rust, Genus' vice president of sales and marketing commented, "The TFH business has been very good for Genus. Not only is it a valuable source of income for the company when other markets are down, but it also has given us a unique opportunity to hone our skills in a production environment. In return, and with our support, our TFH customers have extended their current manufacturing process beyond what was possible with other deposition techniques, in addition to experiencing greater yields at a lower cost of ownership."

About Genus
Genus, Inc. manufactures critical deposition processing products for the global semiconductor industry and the data storage industry. To enable the production of intricate micro-computer chips and electronic storage devices, Genus offers its LYNX and StrataGem series production-proven equipment for 200mm and 300mm semiconductor production, and offers thin film deposition products for chemical vapor deposition (CVD), atomic layer deposition (ALD), and pre-clean capabilities. Genus is at the forefront of market and technology developments in the ALD marketplace, which is gaining acceptance worldwide as a critical technology for sub 0.13-micron production of computer chips and electronic storage devices. Genus' customers include semiconductor manufacturers located throughout the United States, Europe and the Pacific Rim including Korea, Japan and Taiwan. Founded in 1981, the company is headquartered in Sunnyvale, California. For additional information visit Genus' web site at www.genus.com

NOTE: LYNX2®, LYNX3™ and StrataGem™ are trademarks of Genus, Inc

Forward-Looking Statements
This press release contains forward-looking statements regarding the company's future financial and business performance. These forward-looking statements are subject to a number of risks and uncertainties. These contingencies include but are not limited to: actual customer orders received by the company, the extent to which ALD technology is demanded by the marketplace, the actual number of customer orders received by the company, availability of components from suppliers, the timing of final acceptance of products by customers, the financial climate, accessibility to financing and fulfillment of closing conditions, general conditions in the thin film equipment market and in the macro-economy, and the influence of global political events. Genus assumes no obligation to update this information. Additional risks and uncertainties are discussed in the Management's Discussion and Analysis of Results of Operations contained in Genus' Annual Report on Form 10-K for the fiscal year ended December 31, 2001 and subsequent quarterly reports on Form 10-Q filed with the Securities and Exchange Commission.