Genus Ships New Atomic Layer Deposition Technology

SUNNYVALE, Calif. (February 11, 2000) – Genus, Inc. (Nasdaq: GGNS) announced that it has received a multi-million dollar purchase order, and also a letter of intent for its new atomic layer deposition (ALD) technology. In December, Genus shipped its first ALD technology order to a major U.S. semiconductor manufacturer. The letter of intent came from a new major semiconductor customer for Genus, and is scheduled to book and ship by the end of this month. Genus' ALD technology provides solutions at the atomic level for logic and DRAM manufacturers for applications down to 0.1-micron feature sizes and beyond.

"We are extremely pleased with the growing demand for our ALD technology," said Dr. William W.R. Elder, Genus' chairman and CEO. "This is a critical new technology for the semiconductor industry, and Genus is at the forefront of providing the industry with the ability to deposit these new ultra-thin films."

Dr. Thomas E. Seidel, Genus' chief technology officer, commented, "Our ALD technology has received considerable attention since Genus announced demo readiness at SEMICON West in 1999. Genus ALD technology provides a demonstrated thickness control at the atomic level. Films are deposited with outstanding uniformity and conformality, even in extremely large aspect ratio structures. In addition, the technology is delivered on the established LYNX2® platform, providing a direct pathway to production."

The LYNX2 is an advanced, single wafer cluster tool. Proven in high-volume production, the LYNX2 is a multiple film system with up to a four process module capability and a demonstrated high reliability in advanced manufacturing.

Safe Harbor

This press release contains statements that may be deemed forward-looking regarding the use of ALD technology by the semiconductor industry. Any such forward-looking statements are subject to a number of risks and uncertainties, including actual acceptance of ALD technology by the marketplace, potential development of competing technologies, cyclical economic conditions in the semiconductor equipment market, and global economic conditions. Additional associated risks and uncertainties are found in the Management's Discussion and Analysis of Results of Operations section of Genus' Annual Report on Form 10-K for the fiscal year ended December 1999 and in Genus' subsequent quarterly reports on Form 10-Q filed with the Securities and Exchange Commission.

About Genus

Founded in 1982, Genus, Inc. designs, manufactures, and markets capital equipment and deposition processes for advanced semiconductor manufacturing, as well as for other emerging non-semiconductor applications. Genus offers various thin-film deposition modules using its own production-proven equipment and processes for both chemical vapor deposition (CVD) and atomic layer deposition (ALD). The deposition processes are used to manufacture integrated circuits for the computer, communications, medical, military, transportation, and consumer electronics industries. Genus' customers include semiconductor manufacturers located throughout the United States, Europe, and the Pacific Rim, including Korea and Japan. Company headquarters are in Sunnyvale, California. For additional information, visit Genus' Web site at www.genus.com.