Genus Logo - An Enabling Thin Film Equipment Company

CLOSE WINDOW

Genus Introduces New Platform Technology for 300 mm

SUNNYVALE, Calif. (July 11, 2000) – Genus, Inc. (NASDAQ: GGNS) announced today the introduction of its low-pressure chemical vapor deposition platform for 300 mm volume production, called LYNX3™. A new patented single-wafer chamber with superb uniformity capability is a cornerstone element of the LYNX3 system. The new high-throughput, low-cost-of-ownership cluster tool is able to deposit chemical vapor and atomic layer-based films for advanced devices at design rules of 0.18 micron and below.

"Our 300 mm successful strategy has been to attack the uniformity challenge directly in the process chamber, and then combine that with a higher productivity on a flexible platform. In the LYNX3, Genus provides for its customers needs with a bridge platform architecture for either 200 mm or 300 mm production, with enhanced uniformity and productivity," noted Tom Seidel, Genus CTO.

The exceptional uniformity (~1%, one sigma) is achieved by moving the wafer higher than the wafer transport gate valve to achieve a highly cylindrically symmetric chamber environment for the wafer process. This addresses a fundamental challenge for conventional 300 mm CVD tools with focus upon a superior design. The LYNX3 system is based on Genus patented process chamber concept that results in exceptional uniformity in the deposition process.

The LYNX3, an advanced 200/300 mm bridge tool, features increased automation capability while maintaining a minimal footprint. The tool architecture is an advanced seven-sided wafer-handling robotic platform with a dual-end effector robot for high-throughput operation and up to four process modules, plus one auxiliary cool or metrology station. In the four chamber configurations, throughput of 60 wafers per hour (WPH) can be reached.

Using a seven-sided platform, the system architecture provides 33 percent higher productivity relative to six-sided platforms. Each module of the new LYNX3 utilises a new patented chamber design and standardised hardware and software systems.

Bill Elder, Genus CEO, remarks, "LYNX3 is the latest in a series of CVD high-productivity and high-reliability tools pioneered by Genus. The tool can be configured for multiple deposition processes, such as chemical vapour deposition (CVD), plasma-enhanced CVD, and atomic layer deposition (ALD) processes using the entire suite of films, which supports Genus' growth. These include tungsten silicide, tungsten, tungsten nitride, copper, aluminum oxide and tantalum pentoxide materials. These films are applicable for gate stack, capacitor and interconnect deposition markets."

Safe Harbor

This press release contains statements that may be deemed forward-looking regarding the use of ALD technology by the semiconductor industry. Any such forward-looking statements are subject to a number of risks and uncertainties, including actual acceptance of ALD technology by the marketplace, potential development of competing technologies, cyclical economic conditions in the semiconductor equipment market, and global economic conditions. Additional associated risks and uncertainties are found in the Management's Discussion and Analysis of Results of Operations section of Genus' Annual Report on Form 10-K for the fiscal year ended December 1999 and in Genus' subsequent quarterly reports on Form 10-Q filed with the Securities and Exchange Commission.

About Genus

Founded in 1982, Genus, Inc. designs, manufactures, and markets capital equipment and deposition processes for advanced semiconductor manufacturing, as well as for other emerging non-semiconductor applications. Genus offers various thin-film deposition modules using its own production-proven equipment and processes for both chemical vapor deposition (CVD) and atomic layer deposition (ALD). The deposition processes are used to manufacture integrated circuits for the computer, communications, medical, military, transportation, and consumer electronics industries. Genus' customers include semiconductor manufacturers located throughout the United States, Europe, and the Pacific Rim, including Korea and Japan. Company headquarters are in Sunnyvale, California. For additional information, visit Genus' Web site at www.genus.com.

 

COMPANY CONTACT:
Debra Scott
Genus, Inc.
Tel: (408) 747-7120 Ext. 1407
Fax: (408) 747-7199
pr@genus.com

EDITORIAL CONTACT:
Dave Richardson
Positio
Tel: (650) 815-1006 Ext. 101
Fax: (650) 815-1095