LYNX2®

The LYNX2® system is currently used in production by manufacturers of advanced DRAM for devices <0.35 microns. Our LYNX2 systems support over 120 process modules in high volume production environments. Production availability for the LYNX2 system runs from 90-95%.

LYNX2 platforms are also used for customer development and pilot manufacturing for more advanced semiconductor applications below 0.18 micron.

The LYNX2 features a wafer-handling platform that is compatible with the Modular Equipment Standards Committee (MESC). This platform uses a centrally located, dual-end effector robot for high throughput operation.

The system is controlled by a graphical user interface that provides the operator with real-time information such as recipe, set points, hardware status and service features.

The modular design of the LYNX2 allows the addition of up to four process modules, which can be run serially or in parallel. The LYNX2 process module design also offers a multi-zone resistive heater for more uniform wafer heating, gas injection systems for improved film composition uniformity and a state-of-the-art gas delivery system that minimizes chamber-to-chamber variance. In the case of ALD, fast gas switching has been developed for high productivity ALD.